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Workshop Agenda*

3 November 2015
 

8:15 - 9:00 Registration and Breakfast
9:00 - 10:35 Session 1: Photonic Integration Overview and Customer Perspectives
10:35 - 11:00 Coffee Break
11:00 - 12:30 Session 2: Perspectives from the Supply Chain
12:30 - 13:15 Lunch Break
13:15 - 15:00 Session 3: Update on the Photonics Integration Initiatives and Market
15:00 - 15:30 Coffee Break
15:30 - 16:30 Session 4: 100G Technology Panel
16:30 - 16:45 Session 5 - Wrap-up Discussion
17:00 - 18:00 Networking Reception at The Cosmos Club
Business Attire required

 

*times are subject to change
 

Workshop Sessions

Session 1: Photonic Integration Overview and Customer Perspectives

Network operators give their perspectives on the future of network architectures, optical networking, and optical interconnects.  The perspectives examine both the technical and cost requirements of future networks. This session also takes time out to look at the long view of integrated photonics, from early research to the long-range vision for communications and other applications.

Thomas Koch, Dean College of Optical Sciences, University of Arizona, USA
Abstract available soon.

The Microsoft Perspective on Future Data Center Networks
Tom Issenhuth, Optical Network Architect, Microsoft Azure Networking, USA
This presentation will examine Microsoft’s view of how data center networks will evolve, and the implications for optical components.  The architecture places specific demands on the interconnects--particularly with regard to power, latency, and cost--for each link length.  Optics suppliers can help enable this evolution by aiming for these requirements.

HPC and Data Center Applications for Photonic Switching
Marc Taubenblatt, Sr. Mrg. Optical Communications and High Speed Test, IBM, USA
Silicon photonics is emerging as a commercially available technology, vying  for market share in a number of application spaces.  For shorter distance  applications (within and between rack) which continue to make up the bulk of HPC and data center links, Si photonics must compete with the incumbent copper and VCSEL based technologies purely on cost and perhaps power.  Here the functional advantages of Si photonics are more limited, albeit important, providing longer single mode reach at cost advantage over more traditional components. This is an expanding market space as both data rates and run lengths increase in flatter high performance networks.  However this application does not take full advantage of the integration capabilities that Si photonics has to offer.  Incipient deployment of optical circuit switched networks based on millisecond scale MEMs switching is beginning to show promise as a component of higher performance networks.  Optical circuit switching is an application where Si photonics can provide unmatchable technology advantages, by integrating a large number of functions on a single PIC, providing nanosecond scale switching times with reasonably large radix and integrated gain.  While this application is still many years off, it is not achievable without the integration capabilities of a Si photonics integrated circuit.


 

Session 2: Perspectives from the Supply Chain

The workshop questions are addressed by representatives of three layers of the supply chain of integrated photonics: a networking equipment vendor, a subsystem vendor, and a component vendor.  The session will explore commonalities and differences among the three views.

Vikrant Lal, Director, Adv. Product Development, Infinera, USA
Abstract available soon.

Silicon Photonics in Coherent Transponders
Chris Doerr, Director of Integrated Photonics, Acacia Communications, USA
Silicon photonic integrated circuits are well suited for coherent transponders.  The performance is as good as discrete optics, yet the footprint is significantly smaller and they can be made in large volumes with high yield.  

Robert Blum, Director of Strategic Marketing, Oclaro, USA
Abstract available soon.
 

Session 3: Update on the Photonics Integration Initiatives and Market

With the announcement of the winning team for the U.S. integrated photonics manufacturing institute, the next step will be to put the institute into action. This session will review the status of both the new U.S. institute as well as European efforts toward collective R&D on integrated photonics. Also, the session will review the market for integrated photonics products and the economics of manufacturing integrated photonics today.

AIM Photonics What Merging Photonics with Nano-electronics will do
Tino Treiber, Outreach Executive, AIM Photonics, USA
The recently established American Institute for Manufacturing Photonics (AIM Photonics) is a manufacturing consortium headquartered in NY, with funding from the US Department of Defense (DoD), New York State, and industrial partners to advance the state of the art in the design, manufacture, testing, assembly, and packaging of integrated photonic devices. Tino Treiber, Outreach Executive of AIM Photonics, will describe the technical goals, operational framework, near-term milestones, and opportunities for the broader photonics community.

European Activities in Photonic Integration and Packaging
Martin Schell, Executive Director, Fraunhofer HHI, Germany
There is a long history in European collaborative activities on Photonic Integration. Activities are starting addressing Photonic packaging.  These help the community both to share economies of scale and to get better connected. I will give an overview of the major projects,  give some insight into the way these projects come to life, and outline potential future evolutions.

Impact of Silicon Photonics Technology on the Global Market for Optical Communication Products
Vladimir G. Kozlov, Founder and CEO of LightCounting Market Research
Potential impact of silicon photonics on the optical communications market captivated imagination of the industry in the last 3 years. Early success of several optical component vendors in demonstration of capabilities of this technology and shipping first products led to several mergers and high value acquisitions. How much of an impact can this technology make on the market?

This presentation will summarize data on current shipments of silicon photonics products and forecast market developments for 2016-2020. It will illustrate challenges faced by developers of new photonic integrated manufacturing platforms in the past and offer recommendations to vendors entering this field.
 

Session 4: 100G Technology Panel Discussion

Approaches to integrated photonics include a range of solutions, spanning both silicon and III-Vs, and electronics and not, in various combinations. Where are these approaches going, and which approaches fit which applications?  A panel of component suppliers will compare and contrast approaches to 100G products as a way of reviewing approaches to integrated photonics commercialization. 

Panelists:
Vikrant Lal, Director, Adv. Product Development, Infinera, USA
Chris Doerr, Director of Integrated Photonics, Acacia Communications, USA
Peter De Dobbelaere, VP Engineering, Luxtera, USA
Robert Blum, Director of Strategic Marketing, Oclaro, USA
 

Session 5: Wrap-Up Discussion

This moderated discussion will call for key takeaways from presenters and attendees, to identify commonalities from the day-long workshop.

 

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