OSA 2016 International Workshop on Compact EUV & X-ray Light Sources

OSA 2016 International Workshop on Compact EUV & X-ray Light Sources

27-28 October 2016 
Hiroshima, Japan

Chairs
Lahsen Assoufid, Argonne National Laboratory, United States
Patrick Naulleau, Lawrence Berkeley National Laboratory, United States

Hitoshi Tanaka, RIKEN, Japan 

SEE DRAFT AGENDA

Program Overview
Emerging compact extreme-ultraviolet and x-ray sources small enough to be installed in laboratories, manufacturing facilities, and hospitals will revolutionize scientific disciplines complementing large scale synchrotron radiation sources. Applications span a wide range including biomedical, semiconductor manufacturing, fundamental and applied research, environmental engineering, defense and security, and industrial non-destructive testing.
 
To aid in the development of such sources, OSA recently launched a series of international meetings on the topic with the goal of facilitating communications between source developers and end users, disseminating information on currently available sources, and understanding application-based performance targets for future sources. The upcoming two-day workshop will be the fourth in the series and will again gather compact light sources developers, potential users, and others interested in this new field to present their work, exchange ideas, and to network with colleagues with diverse needs and interests.
 
As has been done the past two years, this year’s workshop will be collocated with the International Symposium on Extreme Ultraviolet Lithography to be held in Hiroshima, Japan. This will continue to build upon the work began at the 2013 Incubator again providing a unique opportunity for the EUV and X-ray light sources developers to interact with potential semiconductor industry users, learn about their fundamental and practical needs, and assess the current status of EUV/Soft X-ray sources. The two programs will coordinate to encourage interaction / discussion between the compact x-ray sources developers and the end users. As with past meetings, however, the OSA workshop will remain much broader in scope than EUV lithography further encompassing hard and soft x-ray applications in semiconductor wafer inspection, biomedical, materials, energy, etc.
 
Contributions to the workshop are sought in source concepts, technologies and subsystems as well in current and future potential applications. The workshop will include plenary talks geared towards motivating open discussions and focused breakout sessions.
 

REGISTER HERE FOR THE OSA INTERNATIONAL WORKSHOP

  • OSA Workshop only (up to October 4) DEADLINE EXTENSION to October 12 $560 (¥ 60875.00)
  • OSA Workshop only (after October 5) after October 12$680 (¥ 73920.00)     

Click here to REGISTER for BOTH the OSA Compact EUV and X-Ray Light Sources Workshop and 2016 International Symposium on Extreme Ultraviolet Lithography.

  • Combined Symposium & Workshop registration (Before October 4DEADLINE EXTENSION to October 12$460 (¥ 50005.00)
  • Combined Symposium & Workshop Registration (After October 5) after October 12$580  (¥ 63050.00)    

Meeting Schedule (SEE DRAFT AGENDA)
The program, including continential breakfast, lunch and reception, will be held at International Conference Center Hiroshima, Japan.
 
Day 1: Thursday, 27 October 2016
  • Program begins at 8:30, lunch is included onsite
  • Reception, begins at 18:00
 
Day 2: Friday, 28 October 2016
  • Program begins at 8:30
  • Program adjourns at 13:00