Architectural, Automotive and Consumer Electronic Glass Panel Processing by USP Laser
Presenter: Tony Lee, Coherent Inc.
Machining and cutting of brittle materials by ultra-short pulse (USP) laser is seeing high growth due to increased usage in high tech consumer and commercial applications, notably display glass for electronics, protective glass for photovoltaic solar panels, as well as glass panels for automotive and architectural applications. Compared to other substrate materials such as plastics or metals, glass offers superior optical quality, mechanical resistance, chemical consistency, and temperature stability. With increased market demand comes increased manufacturing demand, and lasers offer excellent opportunities for improved manufacturing solutions with less post processing cost. Lasers can cut, machine, drill, polish, and weld glass. Glass processing can be done by short pulse (nanosecond) or ultra-short pulse (picosecond, femtosecond) laser using ablation or filamentation, or by CW laser using thermally controlled cracking. However, to cut complex patterns with high quality (i.e. low chipping, cracking, etc.), filamentation with USP laser must be used, and similarly to machine complex through hole patterns and to chamfer cut edges ablation with USP laser must be used.. Glass panel thicknesses range from tens of microns (e.g. ultra-thin glass), to millimeter (e.g. consumer electronics and automotive), to centimeter (architectural). Best cutting performance requires a careful selection of both laser process parameters and beam optics. We demonstrate the concept of an “all-laser” solution for glass display processing using both ablation and filamentation for glass thicknesses ranging from 30um to 1cm, using a 100W IR picosecond laser.
Authors:JEAN-PHILIPPE LAVOIE, Coherent Inc. / Tony Lee, Coherent Inc.