Laser Applications Conference (LAC) is an all invited speaker format for industry in Laser Applications at the OSA Laser Congress.
Laser Applications Conference (LAC) is an all invited speaker format for industry in Laser Applications at the OSA Laser Congress. This 3-day meeting focuses on two main topic areas -- Materials Processing and Applications for High Power Lasers. At LAC, you’ll be immersed in an innovative learning environment that introduces new, groundbreaking information, offers insightful knowledge, showcases cutting-edge products, and engages your active participation in important debates and discussions.
Materials Processing
- Surface Modification & Micromachining
- Brittle Materials
- Lasers for Space Applications
- Lasers for Mobility
- Laser-based Additive Manufacturing
- Sub µ Material Processing (or Laser Nano Machining)
Applications for High Power Lasers
- EUV, X-Ray Generation & Particle Acceleration
- Defense/Directed Energy
- Laser Induced Damage Test
- Laser Shock Peening & Forming
- THz Generation & Applications
Committee Members
David Mordaunt, Ball Aerospace & Technologies, United States, Program Chair
Yuji Sano, Institute for Molecular Science, Japan, Program Chair
Johannes Trbola, Trbola Engineering, Germany, Program Chair
Lahsen Assoufid, Argonne National Laboratory, United States
Barry Behnken, AEye, Inc., United States
Heather George, TRUMPF Inc., United States
Thomas Grunberger, TRUMPF Inc., Austria
Ruth Houbertz, Multiphoton Optics GmbH, Germany
Dirk Müller, Coherent Inc., United States
Mohammad Umar, Piracha, AEye, Inc., United States
Danijela Rostohar, Institute of Physics of The ASCR, Czech Republic
Gerald Uyeno, Raytheon Technologies, United States