Program

Workshop Attendees

OIDA Workshop Agenda*

3 March 2019

7:30 - 17:30 Registration Open
7:30 - 8:15 Breakfast
8:15 - 8:30

Welcome Remarks & Opening Comments

8:30 - 10:00

Session 1: Keynotes: Insights on Manufacturing Supply Chains

Moderator: Daniel Kilper, CIAN, University of Arizona

10:00 - 10:30 Coffee Break
10:30 - 12:00

Session 2: Integrated Photonics Supply Chains

Moderator: Peter O'Brien, European Photonics Packaging Pilot Line (PIXAPP) & Tyndall Institute

12:00 - 13:30 Lunch and Poster Session
13:30 - 15:00

Session 3: Emerging Trends in PIC Manufacturing

Moderator: Thomas Brown, University of Rochester

15:00 - 15:30 Coffee Break
15:30 - 17:00

Session 4: Discussion: Where's the Progress

Moderator: Madeleine Glick, Columbia University

17:00 - 17:30

Session 5: Workshop Wrap-up

Moderator: Tom Hausken, The Optical Society (OSA)

17:30 - 19:00 Networking Reception

*times are subject to change
 

Featured Presentations

Session 1: Keynotes: Insights on Manufacturing Supply Chain

An efficient supply chain is among the foremost challenges for a company moving from initial product design and prototyping to volume manufacture. Current photonic supply chains tend to be highly-fragmented, greatly limiting the ability of many companies to bring their new products to market. These keynote presentations bring in-depth perspectives on existing photonic supply chains and challenges encountered to develop and manufacture products, from design and chip fabrication, through to packaging and test. Speakers will provide details of their experience in establishing supply chains and what essential factors are required to ensure advanced photonic products can be brought to market in a fast and cost-effective way.

MODERATOR: Daniel Kilper, CIAN, University of Arizona

PRESENTATIONS INCLUDE:

Supply Chain for Silicon Photonics Interconnect Products
Over the last decade silicon photonics has emerged as a successful scalable technology platform that meets the needs of several high speed interconnect applications. We will discuss how silicon photonics technology can leverage the semiconductor supply chain and where the remaining challenges are.
 
Unique Challenges and Opportunities in Supply Chain of Integraded Photonics
Hong Hou, Intel Corporation

With experience of working in small and big, technology and manufacturing, discrete optics and integrated photonics-based companies over the past decades, the presenter will give an overview on the winning applications of integrated photonics, as well as unique challenges and opportunities in managing its supply chain.

 
Lessons from the Advanced Packaging Supply Chain
Jan Vardaman, TechSearch International
Traditionally, there has been separation between first level (semiconductor packaging) and second level (board assembly).  OSATs dealt directly with the IDM or foundry to design and deliver packaged semiconductors while the EMS companies partnered with the OEMs to design and assemble cards and boards.  In the new advanced packaging business model the distinctions are blurring and companies are learning that design flows need to include the device, the device package, and the board. Coordination between the players and co-design become increasingly important.  This presentation describes changes in the supply chain and lessons that can be applied to photonics packaging. 

 


Session 2: Integrated Photonics Supply Chains

Semiconductor manufacturing is commonly viewed as a set of distinct and linear steps: design, chip fabrication, packaging, and test (including reliability testing).  These steps may be managed as an entirely internal operation, or as a supply chain of internal and contracted operations.  How do companies make choices to keep operations internally or outsource it to contractors?  How does the manufacturer keep the supply chain coherent if it’s divided among different locations and vendors yet so interdependent?  How do you find and convince partners to work with your company?  This panel will present perspectives from different parts of the supply chain. 

MODERATOR: Peter O'Brien, European Photonics Packaging Pilot Line (PIXAPP) & Tyndall Institute

SPEAKERS:

Iñigo Artundo, VLC Photonics
Gloria Höfler, Infinera 
Stefan Preble, Rochester Institute of Technology
Shane Pudvah, Tokyo Electron



Session 3: Emerging Trends in PIC Manufacturing

The technology for manufacturing integrated photonics continues to evolve, as do market opportunities.  What are some of the technologies that could change the capabilities or demands from integrated photonics manufacturers?  This panel will present some examples and consider the trends that may have the most impact on integrated photonics manufacturing and the supply chains that support it.

MODERATOR: Thomas Brown, University of Rochester

SPEAKERS:

Matthias Lauermann, Vanguard Automation GmbH
Nicholas Psaila, Optoscribe
Nuria Sanchez, Medlumics


Session 4: Discussion: Where's the Progress?

 

This panel will bring perspectives from speakers as well as the audience for a more expansive discussion of the realities of establishing a supply chain to manufacture integrated photonics, and what’s needed to resolve the issues surrounding it today, particularly from the view of the small company.  The discussion will draw from earlier in the day as well as new questions.  Has the integrated photonics ecosystem showed progress from a few years ago?  What can we expect going forward and how do we make it happen?

MODERATOR: Madeleine Glick, Columbia University

SPEAKERS:

Donald Adams, Precision Optical Transceivers, Photonics Division
Michael Hochberg, Elenion Technologies
Roy Meade, Ayar Labs​


Session 5: Workshop Wrap-up

This final session of the day will solicit perspectives from speakers and attendees on the key takeaways of the day.  

MODERATOR: Tom Hausken, The Optical Society