(Hybrid) PIC Packaging and the Volume Scale Up
Here PHIX will elaborate on the possibility’s of PIC packaging from prototype to volume assembly using its state of the art manufacturing tools for hybrid assembly. Hybrid assembly is seen as one of the most promising techniques to utilize the best of the chip material system without performance compromise. PHIX demonstrates a roadmap from prototype to high volume without having to develop your own packaging infrastructure using established business models from the electronics industry.
Jeroen Duis, Chief Commercial Officer, PHIX Photonics Assembly
Jeroen Duis received his bachelor’s degree from the Technical University of Rijswijk in 2001. After his study he worked 16 years within TE Connectivity. Within the Fiber Optic Business Unit and corporate technology team he held several positions in engineering, research, technology scouting and management. During this time, he gained a broad experience in: laser processing of glass fibers, WDM multiplexing, low loss optical interconnects, next generation photonic chip packaging for applications in mobile phones, automotive and high speed computing applications. In March 2017 he accepted a position at SMART Photonics, a scale up in Indium Phosphide wafer manufacturing where he was responsible for the business development. November 2018, Jeroen accepted a position as Chief Commercial Officer at PHIX photonics assembly where he is responsible for the commercial activities and the strategic direction for the hybrid packaging. He is the author and co-author of several publications and holds 15 patent applications in the field of optical interconnection technology.