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27 April 2021 – 29 April 2021 OSA Virtual Event - Eastern Daylight Time (UTC - 04:00)
Ligentec

 

What Do You Need to Know to Get a Photonic Integrated Circuit (PIC) in a Few Weeks Time

In this session we will discuss the process of creating a Photonic Integrated Circuit (PIC) and what parameters there are that are given and that you can choose.

  • What is a Process design Kit (PDK)?
  • What building blocks exist in LIGENTEC SiN low loss platform?
  • What is a design manual?
  • Which cross-sections are available?
  • How do I do a PIC design?
  • How long does the fabrication process take?
  • What do I need to test a PIC?

 

Speaker

Michael Geiselmann, Managing Director, Ligentec

Michael Geiselmann (Managing Director) studied physics and engineering at University Stuttgart and Ecole Centrale Paris. After his PhD at ICFO in Barcelona in 2014 he joined the laboratory of Prof. Kippenberg at EPFL in Lausanne, where he advanced frequency comb generation on integrated silicon nitride chips towards applications and was involved in several international research projects. In 2016, he co-founded LIGENTEC and brought the company to the international stage of photonic integration.

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Showcase Presentation

Thursday, 29 April 2021

11:20 - 11:35 EDT (UTC - 04:00)

 

Networking Availability

Thursday, 29 April 2021

10:00 - 12:00 EDT (UTC - 04:00)

 

Contact 

Michael Geiselmann, Managing Director

info@ligentec.com

About Us

LIGENTEC is a Swiss based manufacturing partner, offering low loss SiN Photonic Integrated Circuits (PICs) for industries such as Quantum technologies, LiDAR, Communications, Space and Sensors. Due to its high confinement, the thick nitride waveguides and resonators have low bending losses and excel even in high power applications from the visible to the mid-IR. The main application areas for this advanced silicon photonics low loss technology include coherent telecommunication, LiDAR, metrology, supercontinuum generation, spectroscopy, sensing and microwave photonics. LIGENTEC’s All Nitride Core Technology platform is fully CMOS compatible, thus allowing us to offer ramping up to high volumes benefiting from the scale of the semiconductor industry. 

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