(Hybrid) PIC Packaging and the Volume Scale Up
Here PHIX will elaborate on the possibility’s of PIC packaging from prototype to volume assembly using its state of the art manufacturing tools for hybrid assembly. Hybrid assembly is seen as one of the most promising techniques to utilize the best of the chip material system without performance compromise. PHIX demonstrates a roadmap from prototype to high volume without having to develop your own packaging infrastructure using established business models from the electronics industry.
Jeroen Duis, Chief Commercial Officer, PHIX Photonics Assembly
Jeroen Duis received his bachelor’s degree from the Technical University of Rijswijk in 2001. After his study he worked 16 years within TE Connectivity. Within the Fiber Optic Business Unit and corporate technology team he held several positions in engineering, research, technology scouting and management. During this time, he gained a broad experience in: laser processing of glass fibers, WDM multiplexing, low loss optical interconnects, next generation photonic chip packaging for applications in mobile phones, automotive and high speed computing applications. In March 2017 he accepted a position at SMART Photonics, a scale up in Indium Phosphide wafer manufacturing where he was responsible for the business development. November 2018, Jeroen accepted a position as Chief Commercial Officer at PHIX photonics assembly where he is responsible for the commercial activities and the strategic direction for the hybrid packaging. He is the author and co-author of several publications and holds 15 patent applications in the field of optical interconnection technology.
PHIX is a packaging and assembly foundry for integrated photonics, with a state-of-the-art infrastructure located in Enschede, the Netherlands. We offer assembly services for all major PIC technology platforms (like InP, Si and SiN) and are specialized in hybrid integration of chip-to-chip and fiber-to-chip modules. PHIX provides a one-stop-shop for PIC assembly, from design to volume production. We have developed several packaging solutions that allow for convenient, quick and affordable prototyping of your first photonic integrated circuits (PICs). They provide a housing with electrical connections, optical interfaces, and thermal management. After successful prototyping your device we offer volume packages are available to scale up the production.
If possible, we would like to start collaborating with you at an early stage of your PIC design. The early involvement of our experts can be crucial for the optimal performance, cost and manufacturability of your module, both in small batches and in high volumes.