Meeting the Challenges in Spectral Testing of Photonic Integrated Circuits (PIC)
Photonic integrated circuits (PICs) are a well-known technology in the communications world, driving the efforts for high-speed networks and 5G developments through the rapid evolution of transceivers and components that are much smaller, faster, cheaper and energy-efficient than their bulk-optics predecessors.
With a view to best address spectral test challenges of these up-and-coming components, EXFO has been working closely with the PIC front-end drivers. This webinar delves into the solutions and best practices in overcoming these challenges. We’ll be available to reach out to you as needed during the Q&A session at the end.
- Identifying the challenges in testing PIC technology
- Future-proofing PIC spectral characterization
- Testing throughout the PIC ecosystem; from design to mass production of optical components
Lawrence van der Vegt, Subject Matter Expert, EXFO
Lawrence is an optics veteran; he earned his Bachelors degree in Electrical and Computer Engineering in the Netherlands and has held various key Directorial positions at optical T&M companies in the Netherlands and the U.S.A. He is currently active as a Subject Matter Expert on behalf of EXFO, involved in passive and active component testing driven by PIC technologies.
EXFO (NASDAQ: EXFO) (TSX: EXF) develops smarter test, monitoring and analytics solutions for fixed and mobile network operators, webscale companies and equipment manufacturers in the global communications industry. Our customers count on our unique blend of equipment, software and services to accelerate digital transformations related to fiber, 4G/LTE and 5G deployments.