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2021 OIDA Workshop on Developments in Co-Packaging Technologies for Data Centers

30 - 31 March, 2021
In-person Event - Eastern Time (US & Canada) (UTC -05:00)


Mark Wang

Tencent

About the Speaker
Mark Wang was born in Shanxi, China. He graduated in micro-engineering from Tianjin University and received master’s degree in Fudan University at 2011. In 2019 September, he joined Tencent network architecture team responsible for hardware arch including interconnect, switch etc. Prior to Tencent, he has been working in Mellanox as a senior HW FAE/AE for nic/interconnect/switch. Besides Mellanox, Mark Wang also worked in ZTE where he learnt datacenter switches hardware and its design considerations.

Mark Wang is very experienced in end-to-end hardware design covering switches, optical interconnects, server/nic. He is a member of Tencent infrastructure team researching next-generation technology that will be adopted and also a member of Tencent network operating team responsible for AZ/cluster/pod/server deployments. He is also managing Tencent network lab to test and qualify components including DSP/CDR/laser/nic/switches/etc.
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