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2021 OIDA Workshop on Developments in Co-Packaging Technologies for Data Centers

30 - 31 March, 2021
In-person Event - Eastern Time (US & Canada) (UTC -05:00)


Anu Agarwal

Massachusetts Institute of Technology

About the Speaker
Dr. Anu Agarwal received her doctoral degree in Electrical Engineering from Boston University in 1994, where she investigated the spatial extent of point defect interactions in silicon.

She has been at MIT since 1994, except for a short (2001-2004) stint at Clarendon Photonics, where she was a part of a team of engineers developing a novel optical filter. Currently, as a Principal Research Scientist, she is developing integrated Si-CMOS compatible linear and non-linear materials for photonic devices, especially in the mid-IR regime, for hyperspectral imaging and chem-bio sensing, because most chemical and biological toxins have their fingerprints in this range. She has over 250 journal and refereed conference publications, 17 awarded patents and 4 pending patents. Her work on MIR materials and devices is creating a planar, integrated, Si-CMOS-compatible microphotonics platform which will enable on-chip imaging and sensing applications. As Leader of the AIM Academy LEAP at MIT, since Jan 2018, she is (i) building a roadmap document of photonic sensors through the Integrated Photonic Systems Roadmap (IPSR) and World Technology Roadmap Forum (WTRF), by identifying technology gaps in materials, components and systems for photonic sensors, and (ii) enabling education and workforce development in integrated photonics, and (iii) exploring innovative photonic testing and packaging solutions.
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