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30 March 2021 – 31 March 2021 OSA Virtual Event - Eastern Daylight Time (UTC - 04:00)

Program

Workshop Attendees

OIDA Workshop Agenda*

  Registered Attendees must login to access recorded sessions.

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Access to workshop sessions is restricted to registrants only. The virtual session links are visible only after registrants log in from the program schedule. Click the green button above to login.

Important! The workshop schedule is based on Eastern Daylight Time (EDT, UTC-04:00).

Use an online time converter to translate session times to your local time zone. 

 

Tuesday, 30 March   Wednesday, 31 March

30 March 2021 ALL TIMES ARE EDT, UTC-04:00. Click the session time to convert to your local time zone.
09:45 - 10:00 Welcome Remarks & Opening Comments
10:00 - 10:30

Keynote: AI & ML Systems and Co-Packaged Photonics

10:30 - 12:00

Session 1:  Data Center Requirements and Technology Roadmap

12:00 - 13:00

Session 2:  Embedded Photonic Products for Future Data Centers

13:00 - 13:30

Meet the Speakers -  Session 1: Data Center Requirements and Technology Roadmap

Meet the Speakers - Session 2: Embedded Photonic Products for Future Data Centers

* Limited space. Additional fee- see registration for details.

31 March 2021 ALL TIMES ARE EDT, UTC-04:00. Click the session time to convert to your local time zone.
09:45 - 10:00 Welcome Remarks & Opening Comments
10:00 - 10:30

Keynote: Integrated Photonics for Hyperscale Data Center Applications

10:30 - 11:30

Session 3:  Manufacturing Embedded Photonics

11:30 - 12:30

Session 4:  Metrics Discussion

12:30 - 13:00

Meet the Speakers -  Session 3: Manufacturing Embedded Photonics

Meet the Speakers - Session 4: Metrics Discussion 

* Limited space. Additional fee- see registration for details.

13:00 - 13:15

Workshop Wrap-up

*times are subject to change
 

Keynote 1: Integrated Photonics for Hyperscale Data Center Applications

  • Larry Dennison, NVIDIA

AI & ML systems are entering the market just as Moore’s Law is slowing.  The applications running on these systems are extremely compute intensive and have exceeded the capabilities of single chip solutions.  This creates a demand for network fabrics optimized for the fine-grained, high-bandwidth communications that occur with computational scale-out.  Compute accelerators such as GPUs already have aggregate network connections at 2.4Tb/s which is expected to continue to climb.  This demand for bandwidth carries into the network switches – multiple 100T switches will be needed for even relatively modest systems.  Co-packaged photonics will help enable those systems but only if those systems can simultaneously relax enough constraints to make co-packaged photonics practical.

Session 1:  Data Center Requirements and Technology Roadmap

  • Mark Filer, Microsoft
  • Thomas Liljeberg, Intel
  • Vivek Raghunathan, Broadcom
  • Mark Wang, Tencent
  • Greg Young, Cisco

As data centers continue to scale up to meet the growing demand for cloud and AI applications, operators are looking to new technology solutions, such as disaggregation and embedded photonics. Increased cloud capabilities at the edge for 5G applications introduce yet another set of challenges. This session will examine these larger trends and how they are impacting performance requirements and technology roadmaps.

Session 2:  Embedded Photonic Products for Future Data Centers

  • Nick Harris, Lightmatter
  • Odile Liboiron-Ladouceur, McGill University
  • Sylvie Menezo, Scintel Photonics

There is a growing consensus that next generation (>50T bps) switching technologies will require embedded or co-packaged optical interconnects to achieve commercial bandwidth density requirements.  System integrators are also looking to new architectures and devices to reduce power consumption.  This session will address topics on products, architectures and devices being developed to address future requirements as presented in session 1. This will include highly integrated multichip modules based on SiP and InP platforms and novel architectures to reduce energy consumption.

 Meet the Speakers - Session 1:  Data Center Requirements and Technology Roadmap

  • Mark Filer, Microsoft
  • Thomas Liljeberg, Intel
  • Vivek Raghunathan, Broadcom
  • Mark Wang, Tencent
  • Greg Young, Cisco

Sign up for this additional event (see pricing) to meet in small groups with speakers and have the chance to ask more in-depth questions in an intimate setting. 

 Meet the Speakers - Session 2:  Embedded Photonic Products for Future Data      Centers

  • Nick Harris, Lightmatter
  • Odile Liboiron-Ladouceur, McGill University
  • Sylvie Menezo, Scintel Photonics

Sign up for this additional event (see pricing) to meet in small groups with speakers and have the chance to ask more in-depth questions in an intimate setting. 

Keynote 2: Integrated Photonics for Hyperscale Data Center Applications

  • Rob Stone, Facebook

New workloads such as AI & ML in concert with expanding user demand and richer platform features are combining to continue to place increased demand on data center resources. Infrastructure investments and new technologies are required to support the these trends. One area of focus surrounds improved interconnect efficiency and rationalization of IO architectures. Introduction of  integrated photonics and co-packaged optics is anticipated to enable both future system scaling as well as partially offsetting power increases driven by higher network bandwidths to facilitate operation within a the existing infrastructure constraints.

Session 3:  Manufacturing Embedded Photonics

  • Vikas Gupta, Global Foundries
  • Gilles Lamant, Cadence
  • Yi Qian, MRSI

Current integrated photonic manufacturing capabilities are fragmented, making it difficult for product developers to build their own reliable manufacturing supply chain. To address this, the session will provide a comprehensive overview of established and emerging integrated photonic manufacturing Topics to be addressed include design, wafer foundry, packaging and testing, and the challenges which have to be overcome to provide users with a seamless manufacturing supply chain.

Session 4:  Metrics Discussion

  • Anu Agrawal, MIT
  • Mike Haney, ARPA-E
  • Peter O'Brien, PIXAPP, Tyndall Institute 

This session will bring perspectives on performance and engineering targets for embedded photonics from  various programs.  It will be an opportunity to hear from experts, compare the targets, and for a group discussion. 

Meet the Speakers -  Session 3: Manufacturing Embedded Photonics

  • Vikas Gupta, Global Foundries
  • Gilles Lamant, Cadence
  • Yi Qian, MRSI

Sign up for this additional event (see pricing) to meet in small groups with speakers and have the chance to ask more in-depth questions in an intimate setting. 

Meet the Speakers - Session 4: Metrics Discussion 

  • Anu Agrawal, MIT
  • Mike Haney, ARPA-E
  • Peter O'Brien, PIXAPP, Tyndall Institute

Sign up for this additional event (see pricing) to meet in small groups with speakers and have the chance to ask more in-depth questions in an intimate setting. 

Workshop Wrap-up

This final session of the day will solicit perspectives from speakers and attendees on the key takeaways of the day.