Events
OIDA Workshop on Manufacturing Trends for Integrated Photonics
Managed by Optica
19 March 2017
Los Angeles Convention Center, Los Angeles, California USA
Integrated photonics presents significant opportunities to develop compact and highly functional systems for a range of communication and sensor applications. However, it has unique manufacturing challenges which can limit its commercial exploitation. These challenges are most apparent during the transition from research prototyping to product development and volume manufacture, often referred to as ‘the valley of death’.
An OIDA/CIAN Workshop sponsored by IPIC and Go!Foton
19 March 2017Petree Hall, Los Angeles Convention Center
Los Angeles, CA, USA
Integrated photonics presents significant opportunities to develop compact and highly functional systems for a range of communication and sensor applications. However, it has unique manufacturing challenges which can limit its commercial exploitation. These challenges are most apparent during the transition from research prototyping to product development and volume manufacture, often referred to as ‘the valley of death’.
- This workshop will focus on applications for integrated photonics and the manufacturing challenges related to these applications; from product design, device fabrication, integration and packaging, through to test and reliability. Although most applications present their own unique design and manufacturing challenges, this workshop will identify common themes where users can meet their unique set of requirements within a standardized design and manufacturing framework.
- The workshop will include presentations on the move to design standards and implementation of design rules, standardized device fabrication processes (eg. MPW runs), packaging formats, and system test protocols.
- The workshop will also present case studies which highlight the development cycle for integrated photonic products; from initial design, through to prototyping and scale-up to volume manufacture.
- In addition, a number of foundry service providers will give an overview of their capabilities, including design, fabrication, packaging and test services.
Key questions to be addressed:
- What supply chain, manufacturing, and packaging challenges are common across applications?
- What common or standardized elements exist across applications?
- What resources are available and how can gaps be filled?
"This was my first workshop and I will definitely attend again based on the knowledge and contacts made today". Irene Sterian, REMAP
Organizing Committee
Tom Hausken, OSA, ChairPeter O'Brien, IPIC, Ireland, Chair
Liam Barry, Dublin City University, Ireland
Robert Cannistra, Marist College, USA
Dan Kilper, CIAN, USA
Shayan Mookherjea, University of California, San Diego, USA
Nasser Peyghambarian, CIAN, USA
