OIDA Workshop Program

OIDA Workshop Agenda*

11 March 2018
7:30 - 8:15 Registration and Breakfast
8:15 - 8:30 Welcome Remarks
8:30 - 10:00

Session 1: Keynote Presentations

Moderator: Dan Kilper, CIAN

  • Atsushi Kanno, NiCT 
  • Lute Maleki, Cruise Automation
  • Tod Sizer, Nokia
10:00 - 10:30 Coffee Break
10:30 - 12:00

Session 2: Applications and Challenges

Moderator: Marco Ruffini, IPIC/TCD

  • Boudewijn Docter, Effect Photonics
  • Pim Kat, Technobis
  • Claudio Mazzali, Corning 
  • Idelfonso Tafus Monroy, TUe/Blue Space
  • Anna Tzanakaki, Bristol University 
12:00 - 13:30 Lunch Break and Poster Session
13:30 - 15:00

Session 3: Manufacturing Challenges

Moderator: Ewit Roos, PhotonDelta

  • Chris Cole, Finisar
  • Peter De Dobbelaere, Luxtera
  • Ken Giewont, Global Foundries
  • Richard Visser, Smart Photonics
15:00 - 15:30 Coffee Break
15:30 - 17:00

Session 4: Lessons Learned fron the Electronic Industry

Moderator: Peter O'BrienTyndall

17:00 - 17:30 Session 5: Workshop Wrap-up
17:30 - 19:00 Networking Reception
*times are subject to change

Workshop Sessions

Session 1: Keynotes

Moderator: Dan Kilper, CIAN

Keynote speakers will describe the requirements of an application area that might employ integrated photonics, such as in5G, IoT, and automotive.  The emphasis will be on how connectivity fits into their business models, their outlooks on where their businesses are going, and potential challenges they may face to get to their goals. 

Atsushi Kanno, NiCT 
Lute Maleki, Cruise Automation
Todd Sizer, Nokia

Session 2: Applications and Challenges

Moderator: Marco Ruffini,​ IPIC/TCD

This session will explore deeper into the applications, discussing the needs, technology, and manufacturing around the applications.

Claudio Mazzali, Corning 
Idelfonso Tafus Monroy, TUe/Blue Space
Pim Kat, Technobis
Anna Tzanakaki, Bristol University 
Boudewijn Docter, Effect Photonics

Session 3: Manufacturing Challenges

Moderator: Ewit Roos,​ PhotonDelta

Speakers will provide perspectives and share experiences related to different size organizations and the overall eco-system for bringing integrated photonics based products to market. Issues unique to both small and large companies will be considered.  

Chris Cole, Finisar
Peter De Dobbelaere, Luxtera
Ken Giewont, Global Foundries

Session 4: Lessons Learned from the Electronic Industry

Moderator: Peter O'Brien,​ Tyndall 

Integrated photonics promises to make photonics more like electronics.  The wafer cost of electronics usually dominates the manufacturing cost, while the packaging and assembly cost dominates in photonics.  The industry aims to change that balance with integrated photonics, but many challenges remain.  This session will focus on the manufacturing of integrated photonics by drawing from lessons learned from the manufacture of silicon electronics and circuit boards.   

Vincent Lin, ASE

Sensors and Actuator Semiconductors to Enable Autonomous Driving
Hans StorkSenior Vice President & CTO, ON Semiconductor

The rapid progress of increasing levels of autonomous driving is made possible through the advanced capabilities of semiconductors that handle computation, communication, sensory input and actuator control. 
Starting with an overview of the various semiconductor applications and the associated device features in automobiles, we will highlight the progress in image sensors and processors to enable camera and Lidar functions for autonomous vehicles. In particular, we will show examples of how automotive requirements are challenging to meet due to large dynamic range of environmental conditions as well as stringent safety and quality expectations. 

Packaging Developments from MEMS and Sensors to Application Processors:  Lessons Learned in Co-Design and The Economics of Packaging in Smartphones 
Jan Vardaman, TechSearch International

The packaging and assembly industry has undergone many changes with the growth of the smartphone.  The introduction of an increased number of MEMS and sensors in a platform with high volume provided the opportunity to gain economics of scale for many MEMS and sensor package.  The move from custom packages to standard package formats enabled cost-effective packaging solutions that scale with increased volumes. Products on the market today use many different packages including stacked packages (3D), BGAs, CSPs, WLPs, and leadframe packages such as QFNs are discussed.  Also discussed is the role of silicon and package co-design in meeting the requirements for application processors.  The success of Apple and TSMC in developing the fan-out wafer level package for application processors is discussed. This presentation examines trends in adoption of packages for MEMS and sensors to lower total cost and discusses the growing trend in co-design for new application processor packages.  The role of co-design is examined and lessons that can be applied to optoelectronics packaging are discussed.

Session 5: Workshop Wrap-up

Moderators: Tom Hauken, The Optical Society, Dan Kilper, CIAN  & Peter O'Brien,​ Tyndall 

This session begins with comments from pre-selected speakers who try to summarize the findings of the day in a few words or sentences.  Then the audience is invited to offer the same or discuss them.  This is intended as a way to leave the attendees with more than just presentations, but also some conclusions about ramping to volume manufacturing.

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