Integrated Photonics Research, Silicon, and Nanophotonics (IPR)

13 - 16 七月 2014
Hilton San Diego Resort & Spa, San Diego, California, USA

Submission Guidelines

The submission period for the Advanced Photonics for Communications Congress is now closed.

Submitting to an OSA meeting gives you the added benefit of having your paper peer-reviewed by an expansive committee of experts in the field. If accepted, your paper will be officially published in Optics InfoBase, OSA's Digital Library, and indexed in Ei Compendex and Scopus.

Adherence to the instructions for preparation of the abstract and summary is imperative. Emailed or faxed submissions will not be accommodated. Failure to complete any of the requirements could result in rejection of a submission. Submission and registration is open to all members of the scientific and technical community. It is incumbent on the authors to obtain appropriate approval to present their work to this international forum.

If you have any questions regarding the paper preparation and/or submission process, please contact OSA Technical Papers staff at 1.202.416.6191 or email


35-word Abstract The 35-word abstract should be a brief summary of the work. If the submission is accepted for presentation, this 35-word abstract will be included in the Conference Program Book.

3-page Summary. Within the page limit, the author must include all text, including the 35-word abstract, title, authors, equations, tables, photographs, drawings, figures, and references. The text may be typed either single-spaced or double-spaced. Refrain from use of asterisk, job descriptions, or footnotes.

Page Format: 8 ½-inch x 11-inch page and with 1-inch margins on all sides.

Style Guide

Style Guide

Summaries should be prepared according to the guidelines above and should be submitted electronically in PDF format. The style guides provide a visual representation of the summary format. For your meeting’s specific page maximum refer to the page count in the summary preparation.

Please make sure that the file contains no non-English font packages (for example, Japanese fonts, Korean fonts, Chinese fonts, etc.) in the body of the summary as well as in all figures and tables. Any characters in these fonts may not be viewable by reviewers. In the past, we have had particular trouble with MS-PGothic, MS-Gothic, and MS-Mincho.

If accepted for presentation, the summary will be included in the Technical Digest.

Submission Categories

Topic Categories

  • SC 1: Photonic Devices, Systems & Integration
    • Silicon and other Group IV integrated photonics: devices and complex circuits
      • SOI-based materials,
      • Passive, and active devices
      • Hybrid Light emitters, lasers, isolators, amplifiers, passives
    • III-V and Compound Semiconductor Devices and systems
      • Semiconductor modulators;
      • Filters;
      • Switches;
      • Wavelength converters;
      • VCSELs;
      • Planar amplifiers;
      • Photonic integrated circuits and optoelectronic integrated circuits;
      • Compound semiconductor WDM components;
      • Novel III-V quantum optoelectronic devices;
    • III-V Materiaqls and Processing for Photonics
      • Reliability advances and issues;
      • Emerging packaging technologies.
    • Dielectric and Plymer Waveguides and Waveguide Devices
      • Integrated planar waveguides;
      • Polymer-based waveguide devices;
      • Active/passive integrated components;
      • Switches;
      • Variable optical attenuators;
      • Modulators;
      • Filters;
      • Integrated isolators and circulators;
      • Planar dispersion compensators;
    • Materials and Fabrication Technologies for Photonic Integrated Circuits
      • characterization of linear and nonlinear optical waveguide devices;
      • Micro-machines and micro-optic components;
      • Parallel optical interconnects;
      • Reliability advances and issues;
      • Novel assembly and manufacturing techniques; and lowcost technology for polymer devices.
    • LiNbO3 - and Other Metal-Oxide-Based Switches and Modulators: Ultrahigh-speed; low-Vπ; devices; integrated scanners; and new fabrication methods.
    • Integrated Photonic Circuits and Systems
      • On-chip photonic interconnects
      • Photonic A/D conversion
      • Optical phased arrays
      • Planar dispersion compensators, wavelength selective switches, and other telecom/datacom components

  • SC 2: Advanced Device Concepts: Nanophotonics, Novel Materials, Plasmonics, Metamaterials
  • Nanophotonics:  nanostructured photonic devices
    •  Photonic crystals (waveguides, resonators, light sources)
    •  Quantum dots
    •  Nano-engineered devices for the generation, transport and detection of light
    •  Biological and chemical transducers
    •  Nanostructured photovoltaics
  • Photonics based on 2D materials
  • Plasmonics
    • Emerging applications
    •  Quantum photonic devices and quantum information processing circuits
    •  Biophotonics
    •  Sensors
  •  Nanofabrication Technology
    • Lithography and etching techniques
    •  Growth and deposition approaches
    •  Self-organized methods
    •  Nanoscale structure characterization
  •  Nonlinear Photonic Devices
    • Parametric down conversion
    •  Four wave mixing
    •  Photon pair sources
    •  Strong Light matter interaction
  • Photonic NEMS (nano-electro-mechanical system) Devices
    • Light-force based photonics, optomechanics
  • SC 3: Photonics Theory: Modeling, Computational Techniques and Verification of Theory
    • Theory:
      • Fundamental limitations of photonic systems
      • Foundations of photonic device and circuit theory
      • Transformation optics, cloaking
    • Modeling, Simulation and Computational Techniques:
      • Numerical and semianalytical methods for guided-wave optics;
      • Advances in computational algorithms, physics and coupled models for integrated photonic circuits
      • Circuit simulation analysis and design, in the time and spectral domain
      • Multiphysics simulation: carriers, heat, phonons and mechanical interaction with light
      • Optical system modeling
      • Active, passive and nonlinear device modeling;
      • Feedback controlled and dynamically configurable integrated photonics;
      • Integrated devices for biosensing and other sensors;
      • Nonreciprocal effects and devices;
      • Lasers and VCSEL, light extraction issues;
      • Multimode photonic systems;
      • Plasmon and metallodielectric structures, guiding and resonating;
      • Photonic crystals, composite dielectric, phase change materials, metamaterials;
      • Graphene optoelectronics modeling
    • Verification of Theory and Models
      • Materialparamter Verification
      • Experimental Verificaton of Theories



OCIS Codes

As part of the submission process, authors will be asked to indicate which of the several broad optics categories best characterizes their paper. A list of OCIS codes can be found here:

Presentation Preference

Presentation Preference: The option for Postdeadline Papers is only oral presentation.

Presentation Preference: The options for this meeting are oral only, poster only or oral or poster acceptable. Selection of "Poster Only" indicates that the author is not willing to present an oral presentation. Selection of "Oral Only" indicates that the author is not willing to present a poster. With selection of "Oral Only" or "Poster Only," the paper may be rejected if the committee determines that the paper will not fit in the chosen session type. With selection of "Oral or Poster Acceptable," the committee will take the author’s preference into consideration, but the paper may be scheduled as an oral talk or a poster presentation at the discretion of the committee.