Events
OIDA Workshop on Integrated Photonics High Volume Packaging
Managed by Optica
20 March 2016
California Ballroom, Hilton Anaheim, Anaheim, CA, California USA
Learn New Strategies to Develop Your Integrated Photonics High Volume Packaging Roadmap
Presented by
Workshop Sponsors
Held in conjunction with:
There are several notable efforts going on worldwide to address various aspects of this packaging challenge. This workshop aims to complement these efforts by clarifying what is the vision of the different elements of the ecosystem. Where is the community currently headed with regard to manufacturing tools? Design software? Chip fabrication? Where will we be in 5 years?
The workshop goal will emphasize the roadmap for these critical elements, rather than to review the state of the art today. If possible, speakers and perhaps attendees will be given a draft roadmap to stimulate discussion, for possible publication.
Key questions to be addressed with respect to ICT:
- What are the key obstacles to realizing high volumes and low cost?
- What technologies offer the best solutions to reduce the cost?
- What is the role of standard packaging?
- What is the long term vision for tools, chips, packaging, and electronics?
2016 Program Committee
Tom Hausken, OSA, USA, Chair
Peter O'Brien, Tyndall National Institute, Ireland, Chair
Madeleine Glick, University of Arizona, USA
Dan Kilper, University of Arizona, USA
Shayan Mookherjea, University of California, San Diego, USA
Nasser Peyghambarian, University of Arizona, USA
Ming Wu, University of California, Berkeley, USA