OIDA Workshop on State of the Art Integrated Photonics
This workshop continues a series of OIDA workshops that reviews the state of the art in photonic integration.
Key questions to be addressed related to the limits--and opportunities--of commercializing integrated photonics:
03 11月 - 03 11月 2015
OSA Office, Washington,
Plug and Play IoT EXPO - Where Innovation Meets Investment
LOOKING FOR FUNDING? On Thursday, 10 December from 1:00 pm - 7:00 pm, 10 start-ups will have an opportunity to meet with representatives from major corporations and venture capital companies who are looking for funding opportunities. The event will take place at Plug and Play headquarters in Silicon Valley, CA.
10 12月 - 10 12月 2015
OIDA Workshop on Integrated Photonics High Volume Packaging
Progress continues on the design and clean room fabrication of integrated photonics, and companies have commercialized products based on integrated photonics—using both the InP and silicon platforms. There is growing awareness that the chip fabrication is less of a barrier to commercialization, and more attention is turning to the cost of the overall package. This cost includes not only the bill of materials, but also the cost of assembly tools and labor. Addressing the cost requires an examination of the entire ecosystem, from the chip design and fabrication to the assembly and surrounding electronics.
20 3月 - 20 3月 2016
2016 OSA Executive Forum
Held every year in conjunction with OFC, the OSA Executive Forum features C-level panelists in an informal, uncensored setting discussing the latest issues facing companies in the business. Join more than 150 senior-level executives as they convene to discuss key themes, opportunities, and challenges facing the next generation in optical networking and communications. Highly valued by participants for the frank and open discussions, OSA Executive Forum sessions explore emerging trends and action plans for tackling today's toughest business challenges.
21 3月 - 21 3月 2016
2013 Technology Exploration Forum (TEF 2013)
Sponsored by OIDA
15 – 16 October 2013 at the Network Meeting Center in Silicon Valley’s TechMart
The Ethernet Alliance, a global consortium dedicated to the continued success and advancement of Ethernet technologies, unveiled details of the agenda for its upcoming 2013 Technology Exploration Forum (TEF 2013)
scheduled for 15-16 October 2013 at the Network Meeting Center in Silicon Valley’s TechMart. At TEF 2013, “The Future of Ethernet”, Ethernet industry leaders, stakeholders, and industry visionaries like Ethernet inventor Robert (Bob) Metcalfe, will discuss Ethernet’s path forward. Pioneered by the Ethernet Alliance in order to help develop and facilitate Ethernet industry consensus, these events unite various stakeholders in discussions of the latest developments, new opportunities, and emerging challenges.
Participants serve as a de facto technology advisory board for the Ethernet community, and engage in a free-flowing dialog and exchange of ideas that help set the direction and drive industry activity.
Sponsored by OIDA