- Technologies, components, systems and networks for access, metro and backbone
- Photonics for future internet (i.e. 5G, IoT, Software-Defined, etc.) architectures
- Methods to achieve multi-terabit capacity networking
- Flexible grid / elastic optical networks
- Optical routers and switches, including ROADM, WSS, cross-connects and optical packet/burst switching
- Energy efficient optical networks and devices
- Optical networks resiliency
- Advanced optical modulation formats
- Technologies, systems and interconnects for Data Centers and High Performance Computing
- Cost effective and energy efficient devices for on-chip and chip-to-chip interconnects
- Disaggregated Data Center and HPC architectures, algorithms and protocols
- Optical networks to support inter data center communication and cloud applications
- Control and Management
- Software-defined networks and network function virtualization
- Control and orchestration of optical and wireless (5G - IoT) networks
- Space Division Multiplexed and multi-dimensional devices, systems and networks
- Components and devices utilizing space for a higher degree of integration
- Transmission systems with record capacity
- Unique applications using the spatial dimension
- Optical White Box (Open) (Sub)-Systems for Deeply Programmable Networks
- Open optical transport
- Open network operating systems
Yoshinari Awaji, National Inst of Information & Comm Tech, Japan, MCF Transmission Technology, Invited
Xiaoyuan Cao, KDDI R&D Laboratories, Japan, Title to be Announced, Invited
Roger Dangel, IBM Research GmbH, Switzerland, System-Level Integration of Silicon Photonics Based on Scalable Optical Coupling using Polymer Waveguides, Invited
Chris Develder, Ghent University - iMinds, Belgium, Resilient Backbone Networks for Multi-site Data Centers: Exploiting Anycast (re)routing for Multi-period Traffic, Invited
Liang Du, Google, Current and Future FTTH Networks, Invited
Nicolas Dupuis, IBM T.J. Watson Research Center, CMOS Photonic for Scalable Electrooptic Switch Fabrics, Invited
Xuezhi Hong, South China Normal University, China, AWG Based Passive Optical Interconnects for Datacenters, Invited
Takaaki Ishigure, Keio University, Japan, 2D/3D Optical Wiring Realized with GI-core Polymer Optical Waveguide for High Bandwidth Density on-board Interconnects, Invited
Philip Ji, NEC Laboratories America Inc, United States, Hybrid Optical-electrical Data Center Networks, Invited
Werner Klaus, National Inst of Information & Comm Tech, Japan, Applications of SDM Technologies: From Point-to-point Links to Networks , Invited
Paul Littlewood, Ciena, United States, Filterless Networks: Merely Interesting or Valued Network Technology?, Invited
Elad Mentovich, Mellanox, United States, Title to be Announced, Invited
Chigo Okonkwo, Technische Universiteit Eindhoven, Netherlands, 10-mode SDM Transmission Over Few- and Multi-mode Fibers, Invited
João Pedro, Coriant, Portugal, Challenges of Designing Transparent Flexible-Grid Optical Networks for Maximum Spectral Efficiency, Invited
David Plant, McGill University, Canada, The Evolution of Digital Signal Processing for Optical Interconnects, Invited
Luca Poti, CNIT, Italy, Photonic Devices and Techniques Enabling High Capacity Optical Communications, Invited
Luca Prete, ON.Lab, United States, Building Open and Disaggregated ROADMs, Invited
Stojan Radic, University of California, San Diego, United States, Fundamental and Practical Limits of Nonlinear Transmission in Optical Fiber, Invited
Gregory Raybon, Nokia Bell Labs, United States, High Symbol Rate, Single Carrier, Coherent Optical Transmission Systems for Data Rates from 400 Gb/s to 1.0 Tb/s, Invited
Kim Roberts, Ciena Corporation, Canada, Beyond 100Gb/s, Invited
Taiji Sakamoto, NTT access network service systems lab., Japan, High Spatial Density 4-LP mode 12-core Multi-core Fiber with Low Differential Mode Delay Characteristics, Invited
Massimiliano Salsi, Juniper Networks Inc., United States, Photonics for Packet-Optical Integration, Invited
Clint Schow, University of California Santa Barbara, United States, Photonics for Next-Generation Data Centers, Invited
Motoyoshi Sekiya, Fujitsu Laboratories Ltd., Japan, Optical Network Softwarization: Virtualization and Software-Programmed Networking, Invited
Kenya Suzuki, NTT Device Technology Laboratories, Japan, Optical Devices for ROADM Node Utilizing Spatial and Planar Optical Circuit, Invited
Ken Tanizawa, Natl Inst of Adv Industrial Sci & Tech, Japan, Ultra-compact 32 × 32 Strictly-non-blocking Si-wire PILOSS Switch , Invited
Marina Thottan, Nokia Bell Labs, United States, Resilient Carrier Grade Network Operating Systems, Invited
Yutaka Urino, PETRA, Japan, High-density Optical Interconnects with Integrated Quantum Dot Lasers, Invited
Nicolas Fontaine, Nokia Corporation, United States
Marija Furdek, KTH Royal Institute of Technology, Sweden
Optical Material Studies Technical Group Special Talk
Tuesday, 19 July 2016, 12:30 – 13:30
Join the OSA Optical Material Studies Technical Group for a special talk focused on transparent conductors using silver nanowires and their application to OLED and OPV on flexible substrates. Dr. Craig Arnold of Princeton University will present his talk ‘Silver Nanowire Network Transparent Electrodes for Organic and Hybrid-Organic Devices’ as part of this technical group event. Includes lunch; RSVP required.
to register, pending availability.
University of California, Berkeley, USA
Dr. Ming Wu is Professor of Electrical Engineering and Computer Sciences at the University of California, Berkeley, and Co-Director of Berkeley Sensors and Actuators Center (BSAC). His research interests include optical MEMS (micro-electro-mechanical systems), optoelectronics, and biophotonics.
Professor Wu received his B.S. degree in electrical engineering from National Taiwan University, Taipei, Taiwan, and M.S. and Ph.D. degrees in electrical engineering and computer sciences from the University of California, Berkeley in 1985 and 1988, respectively. From 1988 to 1992, he was a Member of Technical Staff at AT&T Bell Laboratories, Murray Hill, New Jersey. From 1992 to 2004, he was a professor in the electrical engineering department at the University of California, Los Angeles, where he also served as Vice Chair for Industrial Affiliate Program and Director of Nanoelectronics Research Facility. In 2004, he moved to the University of California, Berkeley.
He has published six book chapters, over 140 journal papers and 290 conference papers. He is the holder of 15 U.S. patents. Prof. Wu is a Fellow of IEEE, and a member of Optical Society of America. He was a Packard Foundation Fellow from 1992 to 1997. He is the founding Co-Chair of IEEE/LEOS Summer Topical Meeting on Optical MEMS (1996), the predecessor of IEEE/LEOS International Conference on Optical MEMS. He has served in the program committees of many technical conferences, including MEMS, OFC, CLEO, LEOS, MWP, IEDM, DRC, ISSCC; and as Guest Editor of two special issues of IEEE journals on Optical MEMS.
Toward Hz-level Optical Frequency Synthesis Across the C-band
University of California, Santa Barbara, USA
Abstract: By using a stable comb as an input reference to an integrated heterodyne optical-phase-locked-loop consisting of a coherent receiver, feedback electronics, and an RF synthesizer, precise optical frequencies across many comb lines can be generated.
Biography: Larry A. Coldren is the Fred Kavli Professor of Optoelectronics and Sensors at the University of California, Santa Barbara, CA. He received his Ph.D. in EE from Stanford Univ. and spent 13 years in research at Bell Labs before joining UCSB in 1984, where he holds appointments in the ECE and Materials Departments. He acted as Dean of Engineering at UCSB from 2009-2011. In 1991 he co-founded Optical Concepts, acquired as Gore Photonics, to develop novel Vertical-Cavity Surface-Emitting Laser (VCSEL) modules; and later in 1998, Agility Communications, acquired by JDS-Uniphase (now Lumentum), to develop widely-tunable integrated optical transmitters.
He has authored or co-authored over a thousand journal and conference papers, including numerous plenary, tutorial and invited presentations. He has co-authored 8 book chapters and two textbooks. He has been issued 65 patents and is a recipient of several awards, including the John Tyndall, Aron Kressel, David Sarnoff and IPRM Awards. He is a Life Fellow of the IEEE, and a Fellow of the OSA and IEE as well as a member of the National Academy of Engineering.