Optoelectronic Devices and Integration (OEDI)

Optoelectronic Devices and Integration (OEDI)

16 - 19 June 2015
Wuhan, China

Optoelectronic Devices and Integration (OEDI)  addresses all aspects of optoelectronic devices and integration from concepts, design, modeling, fabrication and characterization of micro/nano-photonic devices and integration to optical communication, optical signal processing, and optical network applications.

Topics of interest include silicon photonics, surface plasma and plasmonics, optoelectronic devices, nonlinear optical devices, polymer devices, radio over fiber related devices, free-space communications related devices, optoelectronic monolithic integration and hybrid integration.

Special emphasis will be given to optical communication and optical signal processing applications such as nano technologies, optical interconnection, optical network subsystems, microwave photonics, radio over fiber subsystems, nonlinear all-optical signal processing, and free-space communications.

Click here to view all topic categories.

Conference Co-Chairs
Jesper Mork; Technical University of Denmark (DTU), Denmark
Xinliang Zhang; Wuhan National Laboratory for Optoelectronics, HUST, China

Local Organizing Chairs

Jianji Dong; Wuhan National Laboratory for Optoelectronics, HUST, China
Jian Wang; Wuhan National Laboratory for Optoelectronics, HUST, China



Baiou Guan, Jinan Univeristy, China
Baojun Li, Sun Yatsen University, China
Chunhua Dong, University of Science and Technology of China, China
Ci-Ling Pan, National TsingHua University, Taiwan, China
Changjun Min, Shenzhen University, China
Chin Tau LEA, Hong Kong University of Science and Technology, China
Daoxin Dai, Zhejiang University, China
Eric Cassan, University Paris-Sud-11, France
Fan Zhang, Peking University, China
Fei Xu, Nanjing University, China
Graham Reed, University of Southampthon, UK
Guowei Lu, Peking University, China
Handong Sun, Nanyang Technological University, Singapore
JamesGates, University of Southampton, UK
Jing Feng, Jilin University, China
Kaikai Xu, University of Electronic Science and Technology of China, China
Kenneth Kin-Yip Wong, University of Hong Kong, China
Lei Xu, Fudan University, China
Lei Zhou, Fudan University, China
Lilin Yi, Shanghai Jiao Tong University, China
Limin Tong, Zhejiang University, China
Linjie Zhou, Shanghai Jiao Tong University, China
Min Qiu, Zhejiang University, China
Minglie Hu, Tianjin University, China
Ming Li, Institute of Semiconductors, Chinese Academy of Sciences, China
Mingzhi Lu, Infinera InC, USA
Shilong Pan, Nanjing University of Aeronautics and Astronautics, China
Shu-Wei Huang, University of California, Los Angeles, USA
Vivian Xi Chen, Bell Labs,USA
Xi Xiao, Wuhan Research Institute of Posts & Telecommunications, China
Xinlun Cai, Sun Yatsen University, China
Xiaoyong Hu, Peking University, China
Xianmin Jin, Shanghai Jiao Tong University, China
Xia Guo, Beijing University of Technology, China
Yikai Su, Shanghai Jiao Tong University, China
Yufang Liu, Henan Normal University, China
Zheyu Fang, Peking University, China
Zhongqi Pan, University of Louisiana at Lafayette, USA

OSA - The Optical Society