Events
OIDA Workshop Agenda*
11 March 2018| 7:30 - 8:15 | Registration and Breakfast |
| 8:15 - 8:30 | Welcome Remarks
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| 8:30 - 10:00 |
Session 1: Keynote Presentations Moderator: Dan Kilper, CIAN
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| 10:00 - 10:30 | Coffee Break |
| 10:30 - 12:00 |
Session 2: Applications and Challenges Moderator: Marco Ruffini, IPIC/TCD
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| 12:00 - 13:30 | Lunch Break and Poster Session |
| 13:30 - 15:00 |
Session 3: Manufacturing Challenges Moderator: Ewit Roos, PhotonDelta
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| 15:00 - 15:30 | Coffee Break |
| 15:30 - 17:00 |
Session 4: Lessons Learned from the Electronics Industry Moderator: Peter O'Brien, Tyndall
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| 17:00 - 17:30 | Session 5: Workshop Wrap-up Moderators: Tom Hausken, OIDA, Dan Kilper, CIAN & Peter O'Brien, Tyndall |
| 17:30 - 19:00 | Networking Reception |
Workshop Sessions
Moderator: Dan Kilper, CIAN
Keynote speakers will describe the requirements of an application area that might employ integrated photonics, such as in5G, IoT, and automotive. The emphasis will be on how connectivity fits into their business models, their outlooks on where their businesses are going, and potential challenges they may face to get to their goals.
PRESENTATIONS INCLUDE:
Seamless Waveform Transport Technologies for Future Mobile and Sensor Networks
Atsushi Kanno, National Institute of Information and Communications Technology
Waveform transport technology for future 5G and beyond mobile communication systems is discussed, particularly focusing on radio over fiber technologies. Use cases based on the radio over fiber systems are reviewed and discussed for application to high-speed train communication networks and sensor over fiber systems.
5G Network Challenges and their Impact Upon Optical Architecture and Integrated Photonic Devices
Theodore (Tod) Sizer, Nokia Bell Labs
Expectations of the impact that 5G will have on our society are high based upon proposed new and exciting applications and experiences, unavailable using today’s LTE technology. While many of these new uses are directly for humans, most are for machines which assist us humans, and thus have markedly different expectations from the networks that serve them. Four network expectations are already clear: Processing will move to the distributed cloud to the greatest extent possible to support dynamic processing; Dynamic and Deterministic networks are required with guarantees on speed, latency, reliability, and security; Higher data rates, driven by new Massive MIMO and mmWave radio systems will necessitate use of fiber to transport information from the antenna to the cloud; and networks will evolve to “short” wireless and “long” fiber as radio range decreases causing the need for an expansion in the number of access points connected over fiber. These expectations, and others, will drive the requirements of the optical networks and devices supporting this network expansion. In my talk, I’ll address these issues, and offer some thoughts on directions and solutions the industry might take to meet the high expectations that 5G brings.
Session 2: Applications and Challenges
Moderator: Marco Ruffini, IPIC/TCD
This session will explore deeper into the applications, discussing the needs, technology, and manufacturing around the applications.
PRESENTATIONS INCLUDE:
Challenges in PIC Packaging
Pim Kat, Technobis IPPS
Packaging of PIC’s appears far more critical for the chips than packaging of electronic chips. Internal stresses, temperature fluctuations, temperature gradient on the chip, all contribute to changes in functionality of the chip after packaging. This presentation depicts on critical aspects of PIC packaging and how these are addressed properly in order to achieve mature assembly capability and production of PIC packages.
5G as a Catalyst for Optical-Wireless Convergence in the Access
Claudio Mazzali, Corning
We will discuss how 4G/5G densification can act as a catalyst for true converged optical-wireless access networks. The expected optical infrastructure necessary and how different choices of architectures and topologies can impact the requirements and demand for outside plant ready optical links and integrated photonic components. This expected fiber-rich platform enabling the convergence of 5G fronthaul with other access networks will open new opportunities for cost effective IoT, smart cities, edge computing and other upcoming services and applications.
5G PPP blueSPACE project: Building on the Use of Spatial Multiplexing 5G Networks Infrastructures and Showcasing Advanced Technologies and Networking Capabilities
Idelfonso Tafur Monroy, Eindhoven University of Technology (TU/e) and Photonic Integration Technology Center (PITC)
This is a presention of the concept of the European 5G PPP project BLUESPACE whose core is to exploit the added value of Spatial Division Multiplexing (SDM) in the Radio Access Network (RAN) with efficient optical beamforming interface for the pragmatic Ka-band wireless transmission band. Both being seamlessly integreable in next generation optical access networks infrastructures with massive beam steering capabilities and with flexible network management control. We discuss as well the role of photonics in BLUESPACE and related 5G PPP projects fort the realization of a truly viable and efficient path for 5G wireless communications with a 1000-fold increase in capacity, connectivity for over 1 billion users, strict latency control, and network software programming.
Optical Networking Technologies in Support of 5G
Anna Tzanakaki, Bristol University
This presentation focuses on the provisioning of a variety of 5G services over converged network and compute infrastructures. Currently these services are supported through distinct and separate application-specific platforms having significant installation, operational and administrative costs. To overcome these inefficiencies we propose the adoption of flexible and elastic optical networking to support transport network requirements combined with novel concepts such as disaggregation of hardware (HW) and software (SW) components. “Resource disaggregation” enables the creation of a “pool of resources” that can be individually selected and allocated on demand to compose any infrastructure service. The performance of the proposed solution is evaluated through modeling results. Some insight of the 5G UK Trials work currently ongoing at Bristol, UK, deploying some of these architectural principles, will be also discussed.
Low-cost and Flexible Tunable Transmitters for Future-Proof Access Networks
Joost Verberk, EFFECT Photonics
Future access networks will have to serve a broad variety of applications that all have different requirements. This means that the components in the network need to be flexible in their operation, while maintaining a low cost structure. In this presentation we will be looking at how photonic integration technology can provide low cost tunable lasers that have core network performance at access network price points.
Session 3: Manufacturing Challenges
Moderator: Ewit Roos, PhotonDelta
Speakers will provide perspectives and share experiences related to different size organizations and the overall eco-system for bringing integrated photonics based products to market. Issues unique to both small and large companies will be considered.
PRESENTATIONS INCLUDE:
Leveraging Semiconductor Technologies for the Manufacturing of Advanced Optical Interconnect Solutions
Peter De Dobbelaere, Luxtera
Silicon Photonics is in volume production by multiple suppliers. Most of the applications are in the area of intra datacenter interconnect. In our presentation we will briefly discuss how we use the semiconductor ecosystem for high volume manufacturing of high performance, low cost optical transceivers. We will also highlight future advanced integration of photonic transceiver functionality with ASICs leveraging 2.5D integration technologies.
GLOBALFOUNDRIES 300mm Silicon Photonics Foundry
Ken Giewont, GLOBALFOUNDRIES
Silicon Photonics applications are rapidly expanding into several market segments which will continue to drive demand for rapid product development hardware turn-around with a seamless path to product qualification and volume manufacturing. GLOABALFOUNDRIES will present an overview of their 300mm Silicon Photonics Foundry offering which includes a broad photonic device library with monolithic CMOS, passive fiber attach and custom design options. A state-of-the-art Cadence PDK is offered which enables co-design of electrical and optical components with a full suite of standard design tools. Optical test capability for use in manufacturing controls, technology development, modeling and product wafer level testing will be described. Unique manufacturing challenges associated with Silicon Photonics will be presented. The technology qualification, MPW availability and development roadmaps will be shared.
Daniel Mahgerefteh, Finisar Corporation
The Challenge of Manufacturing PICs on InP
Richard Visser, SMART Photonics B.V.
From making 16 discrete lasers on 1mm² to a PIC of 16mm². From manufacturing a few hundred 2” InP wafers per year to thousands of 4” wafers per month. Manufacturing PIC’s requirements requires InP Fabs to improve performance and to change to a larger wafer size. The real challenge however is the lack of standards and how to manage the diversity of processes.
Session 4: Lessons Learned from the Electronics Industry
Moderator: Peter O'Brien, Tyndall
Integrated photonics promises to make photonics more like electronics. The wafer cost of electronics usually dominates the manufacturing cost, while the packaging and assembly cost dominates in photonics. The industry aims to change that balance with integrated photonics, but many challenges remain. This session will focus on the manufacturing of integrated photonics by drawing from lessons learned from the manufacture of silicon electronics and circuit boards.
PRESENTATIONS INCLUDE:
Next Wave of RF & Photonics Packaging Solution
Vincent Lin, ASE Group
When Moore’s law goes slow, driving force of connectivity and cloud services are still very strong. Data growth requirement exceed the improvement speed of any kind of individual chip technology (ex: CMOS), therefore, heterogeneous integration is the solution of de-bottleneck of bandwidth. OSAT now is not only driven by the requirement of digital CMOS, but also provide solutions of emerging technologies of RF and Photonics. RF module of mobile device and Si-Photonic module of data center are the key components of two ends of cloud services platform, both of them need high speed interconnection amount chips with different materials, includes compound semiconductor, silicon and passives or special crystal. Impendence matching and lower insertion loss are the key performance index. In this presentation, we will reveal new package platforms of both RF-module and Si-Photonics module; innovated solutions are proposed to enable further miniaturization while keeping high performance and functional integration.
Sensors and Actuator Semiconductors to Enable Autonomous Driving
Hans Stork, Senior Vice President & CTO, ON Semiconductor
The rapid progress of increasing levels of autonomous driving is made possible through the advanced capabilities of semiconductors that handle computation, communication, sensory input and actuator control.
Starting with an overview of the various semiconductor applications and the associated device features in automobiles, we will highlight the progress in image sensors and processors to enable camera and Lidar functions for autonomous vehicles. In particular, we will show examples of how automotive requirements are challenging to meet due to large dynamic range of environmental conditions as well as stringent safety and quality expectations.
Packaging Developments from MEMS and Sensors to Application Processors: Lessons Learned in Co-Design and The Economics of Packaging in Smartphones
Jan Vardaman, TechSearch International
The packaging and assembly industry has undergone many changes with the growth of the smartphone. The introduction of an increased number of MEMS and sensors in a platform with high volume provided the opportunity to gain economics of scale for many MEMS and sensor package. The move from custom packages to standard package formats enabled cost-effective packaging solutions that scale with increased volumes. Products on the market today use many different packages including stacked packages (3D), BGAs, CSPs, WLPs, and leadframe packages such as QFNs are discussed. Also discussed is the role of silicon and package co-design in meeting the requirements for application processors. The success of Apple and TSMC in developing the fan-out wafer level package for application processors is discussed. This presentation examines trends in adoption of packages for MEMS and sensors to lower total cost and discusses the growing trend in co-design for new application processor packages. The role of co-design is examined and lessons that can be applied to optoelectronics packaging are discussed.
Moderators: Tom Hausken, OIDA, Dan Kilper, CIAN & Peter O'Brien, Tyndall
This session begins with comments from pre-selected speakers who try to summarize the findings of the day in a few words or sentences. Then the audience is invited to offer the same or discuss them. This is intended as a way to leave the attendees with more than just presentations, but also some conclusions about ramping to volume manufacturing.
